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Printed Circuit Boards Job TravelerAt Electro Circuit, we always strive for the highest levels of quality in the printed circuit boards that we produce for our customers. Shown here is our Job Traveler document that accompanies a PCB batch from blank material to finished, tested printed circuit boards. Throughout the entire production process, each step is carefully audited to insure the very highest quality PCBs, whether for a full production run or for a small prototype printed circuit boards batch. |
| Job Traveler | |||||
| Sequence | Descriptions | W. Instructions | Qty-Acc | Qty-Rej | Initial/Date |
| Step 1 |
Sheer Material (layer) Type: |
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| Step 2 |
Punch Layer |
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| Step 3 |
Chemical Clean or Pumice Layer |
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| Step 4 |
Coat Resist-Layers Type: |
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| Step 5 |
Expose Layers |
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| Step 6 |
Develop Layers |
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| Step 7 |
Etch Layers Note: 1st Off Inspection |
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| Step 8 |
Strip Layers |
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| Step 9 |
Inspect Layers |
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| Step 10 |
Oxide Layers |
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| Step 11 |
Bake Layers |
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| Step 12 |
Kit Layers |
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| Step 13 |
Lay Up Layers |
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| Step 14 |
Press Layers |
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| Step 15 |
Acid Clean Panels |
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| Step 16 |
Wash Panels |
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| Step 17 |
Sheer Panel Type: |
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| Step 18 |
Drill Note: 1st Off Inspection |
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| Step 19 |
First Route |
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| Step 20 |
Deburr / Wash |
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| Step 21 |
Etch Back Panels |
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| Step 22 |
Electro less Copper Inspect electro less copper |
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| Step 23 |
CU Flash or Panel Plate |
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| Step 24 |
Scrub in 107 for Outer Layer Resist |
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| Step 25 |
Coat Resist - Panels Type: |
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| Step 26 |
Expose Panels |
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| Step 27 |
Develop Panels |
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| Step 28 |
Plate Copper (Electro Plate) |
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| Step 29 |
Plate Tin / Tin Lead |
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| Step 30 |
Strip Resist |
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| Step 31 |
Second Drill / Route |
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| Step 32 |
Etch Panels Note: 1st Off Inspection |
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| Step 33 |
Strip Tin / Tin Lead |
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| Step 34 |
IN-PROCESS INSPECTION |
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| Step 35 |
Scrub in 107 for Solder Mask |
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| Step 36 |
Bake before Solder Mask Note: 15 mins @ 150 F |
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| Step 37 |
Screen Solder Mask (LPI) |
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| Step 38 |
Pre Bake Note: 30-40 Min @ 175 F |
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| Step 39 |
Expose Panels |
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| Step 40 |
Develop Panels Note: Check 1st Off |
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| Step 41 |
Bake for Curing Mask Note: 1.25 hr @ 300 F |
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| Step 42 |
Shear for Gold Tips Plating |
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| Step 43 |
Plate Ni / Au (electroplate gold) |
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| Step 44 |
Clean for HASL |
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| Step 45 |
HASL Note: HASL 1st Off Inspect |
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| Step 46 |
Wash Panels |
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| Step 47 |
Screen Idents |
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| Step 48 |
NC Route / Score Panels Note: 1st Off Inspection |
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| Step 49 |
Wash Off |
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| Step 50 |
Electrical Testing |
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| Step 51 |
Final Inspection |
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| Step 52 |
Packing |
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| Step 53 |
Shipping |
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RoHS Compliance | Printed Circuit Boards | PCB | PCB Fabrication | Prototype Printed Circuit Boards |
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